By Preeti S Chauhan,Anupam Choubey,ZhaoWei Zhong,Michael G Pecht
This severe quantity presents an in-depth presentation of copper twine bonding applied sciences, tactics and kit, besides the industrial advantages and hazards. Due to the expanding rate of fabrics used to make digital parts, the electronics has been swiftly relocating from excessive price gold to seriously cheaper price copper as a twine bonding fabric. However, copper twine bonding has a number of method and reliability issues because of its fabric houses. Copper twine Bonding e-book lays out the demanding situations keen on changing gold with copper as a twine bond fabric, and comprises the bonding procedure changes—bond strength, electrical flame off, present and ultrasonic power optimization, and bonding instruments and kit adjustments for first and moment bond formation. In addition, the bond–pad metallurgies and using naked and palladium-coated copper wires on aluminum are offered, and gold, nickel and palladium floor finishes are mentioned. The ebook additionally discusses top practices and proposals at the bond technique, bond–pad metallurgies, and applicable reliability assessments for copper wire-bonded digital components.
In precis, this book:
- Introduces copper cord bonding technologies
- Presents copper cord bonding processes
- Discusses copper twine bonding metallurgies
- Covers contemporary developments in copper twine bonding together with the bonding strategy, gear adjustments, bond–pad fabrics and floor finishes
- Covers the reliability assessments and concerns
- Covers the present implementation of copper twine bonding within the electronics industry
- Features one hundred twenty figures and tables
Copper twine Bonding is an important reference for execs looking specific info on all elements of copper cord bonding technology.
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